An effective vision technique for microchip lead inspection

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dc.contributor.authorMir-Nasiri, Nazim
dc.contributor.authorAl-Obaidy, Haitham H. L.
dc.contributor.authorSalami, Momoh-Jimoh E.
dc.contributor.authorAmin, Shamsuddin
dc.date.accessioned2019-11-04T15:36:08Z
dc.date.available2019-11-04T15:36:08Z
dc.date.issued2003-12-10
dc.description.abstractA new effective method for the microchip lead inspection for the chip manufacturing industry has been developed in this work. In contrast to the gray scale pattern matching technique this approach employs selected parameters of binary blobs to perform fault detection and measurements. This leads to a significant reduction of image processing time. A special combination of gray level filtering techniques with gray morphological operations enhances the borders of the lead images. Newly developed threshold calibration technique significantly improves the measurement accuracy. A unique statistical analysis has been developed to identify all possible lead defects in the chips. This method is rotationally and scale invariant and able to detect defective leads for the chips with different specifications. The minimum required information about the microchip is the number of leads.en_US
dc.identifier.citationMir-Nasiri, N., Al-Obaidy, H. H., Salami, M. J., & Amin, S. (2003, December). An effective vision technique for microchip lead inspection. In IEEE International Conference on Industrial Technology, 2003 (Vol. 1, pp. 135-139). IEEE.en_US
dc.identifier.uri10.1109/ICIT.2003.1290256
dc.identifier.urihttp://repository.elizadeuniversity.edu.ng/handle/20.500.12398/626
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.subjectInspectionen_US
dc.subjectSemiconductor device measurementen_US
dc.subjectManufacturing industriesen_US
dc.subjectPattern matchingen_US
dc.subjectPerformance evaluationen_US
dc.subjectFault detectionen_US
dc.subjectImage processingen_US
dc.subjectFilteringen_US
dc.subjectMorphological operationsen_US
dc.subjectCalibrationen_US
dc.titleAn effective vision technique for microchip lead inspectionen_US
dc.typeArticleen_US
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