Fuzzy based technique for microchip lead inspection using machine vision

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dc.contributor.authorHawari, Yasser
dc.contributor.authorSalami, Momoh-Jimoh E.
dc.contributor.authorAburas, Abdurazzag A.
dc.date.accessioned2019-11-04T11:51:35Z
dc.date.available2019-11-04T11:51:35Z
dc.date.issued2008-05-13
dc.description.abstractThis research develops a fuzzy based algorithm for microchip image lead Inspection. Leads are inspected for count, planarity, offset, pitch and span defects. Firstly, it utilizes fast preprocessing techniques and blobspsila features extraction methods to achieve high inspection rates. Using the features extracted, the algorithm first finds a proper thresholding value. It then applies fuzzy logic to make a decision on the status of the IC based on these features. The algorithm proposes a structured way for building the fuzzy systems as well as the associated set of inference rules.en_US
dc.identifier.citationHawari, Y., Salami, M. J., & Aburas, A. A. (2008, May). Fuzzy based technique for microchip lead inspection using machine vision. In 2008 International Conference on Computer and Communication Engineering (pp. 1222-1226). IEEE.en_US
dc.identifier.uri10.1109/ICCCE.2008.4580800
dc.identifier.urihttp://repository.elizadeuniversity.edu.ng/handle/20.500.12398/622
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.subjectInspection,en_US
dc.subjectMachine visionen_US
dc.subjectFiltersen_US
dc.subjectCharge coupled devicesen_US
dc.subjectImage edge detectionen_US
dc.subjectFeature extractionen_US
dc.subjectInference algorithmsen_US
dc.subjectManufacturingen_US
dc.subjectComputer visionen_US
dc.subjectMechatronicsen_US
dc.titleFuzzy based technique for microchip lead inspection using machine visionen_US
dc.typeArticleen_US
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